Flex pcb1/2/2023 Performance of PEN is better than that of PET and worse than that of PI so that the applications of PEN keep going up. PET resin features agreeable mechanical and electrical performance and its biggest disadvantage is bad heat resistance, leading it to be incapable of direct soldering and assembly. Based on regulations released by EU (Europe Union) and lots of countries, 6 types of hazardous substances are forbidden to be available in electronic devices since July, 2006 and PCBs including flexible PCBs mustn't contain brominated flame retardant. Upgraded PI film features humidity absorption of 0.7% which is much lower than ordinary rate that is 1.6% and features higher dimensional stability, converting from ☐.04% to ☐.02%.īoth flexible CCL and rigid CCL call for environmental requirement that is halogen free, which is an inevitable and stringent trend of electronics industry. However, PI leads to high humidity absorption and bad tear strength, which should be improved. PI features high thermal resistance and excellent electrical characteristics. However, it can still maintain flexibility and elasticity after thermal polymerization, which is different from majority of thermosetting resin. The leading substrate material for flexible copper clad laminate (FCCL) covers PI, a type of thermosetting resin that won't reach a temperature to become softened or be able to flow. Substrate materials film should be picked up based on their performance and cost. Usually-applied substrate material for flexible PCB includes PI (polyimide) film and PET (polyester) film apart from which polymer film is also available like PEN (polyethylene nphthalate), PTFE and Aramid etc. Moreover, it has to be able to be bent and curled. The functions of film substrate material lie in its capability to provide conductor carrier and insulating medium between circuits.
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